Yixing Dingfan New Energy Technology Co., Ltd

Yixing Dingfan New Energy Technology Co., Ltd

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Preformed Bar Solder Lead Free Good Solderability Strong Antioxidant

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Country/Region:china
Contact Person:MrZhou
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Preformed Bar Solder Lead Free Good Solderability Strong Antioxidant

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Brand Name :Dingfan
Place of Origin :China
MOQ :300 kg
Price :Negotiate
Payment Terms :T/T, L/C
Supply Ability :100 tons per year
Delivery Time :5-8 workdays
Packaging Details :Standard Export Package
Name :Preformed Solder Bumps
Advantage :Good solderability
shape :strip
Custom processing :yes
melting point :Low
Features :Strong antioxidant capacity
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Preformed Solder Bumps Strip Lead-Free Solder Bars

Product Description

Lead-free solder
Sn-0.7Cu alloy
The Sn-0.7Cu alloy is a eutectic alloy of Sn and Cu, and the eutectic temperature is 227°C. Generally speaking, the working temperature of Sn-0.7Cu alloy for wave soldering is about 245-260℃, and users can also make appropriate adjustments according to the equipment and process conditions used.

Sn-0.7Cu solder advantages:
●High strength and anti-drop performance, with good mechanical properties and solder joint reliability

●Low sensitivity to impurity elements, stable performance and easy recovery, more in line with environmental protection requirements

●Suitable for various welding processes: wave soldering, tin furnace tin plating process, etc.

●Pb-free alloy without silver, with lower cost.

SAC305 Solder Advantages
The yield is better than SAC0307, and the bridging resistance is better than Sn/Cu0.7 alloy; very good fluidity reduces the bridging level;
●The typical wetting speed is 0.65sec, which is equivalent to 0.75sec of SAC0307, far better than Sn/Cu0.7 alloy;
●High purity, low oxide, low tin dross generation;
●Good solderability; fast wetting speed; higher yield,
●Compatible with various fluxes.
●Thermal cycle performance

Lead-free alloy type

alloy composition melting point(℃) proportion use
solidus liquidus (g/cm3)
1 Sn-Cu0.7 227 227 7.32

Dip Soldering, Wave Soldering
Tin furnace added

2 Sn-Ag0.3-Cu0.7 217 228 7.33
3 Sn-Ag3.0-Cu0.5 217 218 7.40
4 Sn99.95 232 232 7.28 Wave Soldering Addition to Reduce Copper Content
5 Sn-Ag3.5 221 221 7.37
6 Sn-Sb5 240 245 7.25
7 Sn-Bi58 138 138 8.54 low temperature welding
8 Sn-In52 118 118 7.3 low temperature welding

Other solder alloys are available upon request.

Advantage

Strong antioxidant capacity
Good liquidity and sufficient volume
Easy to use and no cleaning
High-purity metal raw materials

Be applicable

It is used for PCB circuit boards, metal shells, metal-glass packages, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, sensors, and metal shells or ceramic shells for hermetically sealed packaging of optoelectronic devices.

Generally divided into:

Standard Type: 0.025mm, 0.05mm

Thinner: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm

Thicker type: 0.5mm-1.0mm

Thickened type: 1.0mm or more

Width: generally about 50mm

For example: 50*0.05mm, which means the width is 50mm and the thickness is 0.05mm.

Tip: Other thicknesses and widths can be customized according to customer requirements

Packaging and Shipping

Packing Details : Carton and wooden box packaging

Delivery Details : 5-10 days(Negotiated and decided on a case-by-case basis)

FAQ

1.Are you trading or manufacturer ?
We are company,and we have our own factory

2.How long is your delivery time?

Quantity(kilograms) 1 - 500 >500
Est. Time(days) 10 To be negotiated

3.Do you provide samples ? is it free or extra ?
Yes, we could offer the sample for free charge but do not pay the cost of freight.

If you have another question, pls feel free to contact us

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